We hold four core technologies: ROIC Design, MEMS Pixel Design, MEMS Process, Vacuum Encapsulation and Lithography. We realize independent and controllable full processes from R&D to mass production for the entire lithography detector series, with an annual production capacity of over 10 million various visual sensors.

widely applied in industrial fields including industrial temperature measurement, security monitoring, fire protection, outdoor operations, as well as law enforcement and search & rescue.

Long-Wave Infrared Detector,Non-cooled Infrared Detector,Ceramic Package LWIR Sensor,LW12812HCOB

Pixel array: 1280×1024

Pixel center distance: 12 μm

Response band: 8 μm - 14 μm

NETD: ≤ 50 mk (@ F1.0, 300K)

Output signal: Digital 14-bit LVDS 4 channels

Thermal response time: 12 ms

Frame rate: 25 Hz

Power consumption: ≤ 500 mW @ 300K

Postting form: WLP/TECless -> HCOB Postting

Operating mode: No TEC, OOC

Operating temperature range: -40°C ~ 85°C

Chip size: 40×40×6.7 mm

Weight: 30 ± 0.2 g