We hold four core technologies: ROIC Design, MEMS Pixel Design, MEMS Process, Vacuum Encapsulation and Lithography. We realize independent and controllable full processes from R&D to mass production for the entire lithography detector series, with an annual production capacity of over 10 million various visual sensors.

widely applied in industrial fields including industrial temperature measurement, security monitoring, fire protection, outdoor operations, as well as law enforcement and search & rescue.

uncooled infrared detector, VOx vs a-si，Raytron, Vanadium oxide detector,polymr microbolometer, Uncooled ir fpa,Microbolometer,IR fpa

Pixel array: 640×512

Pixel center distance: 12 μm

Response band: 8 μm - 14 μm

NETD: ≤ 35 mk (@ F1.0, 300K)

Output signal: Digital 14-bit 7 channels

Thermal response time: 12 ms

Frame rate: 50 Hz

Power consumption: ≤ 200 mW @ 25 °C

Postting form: Ceramic postting

Working mode: No TEC, OOC

Operating temperature range: -40 °C -~85 °C

Chip size: 22.86X22.86X3.63 mm

Weight: 6.3 ± 0.1 g